We offer services to manufacture PCBs of any shape, mask color, by single or group arrangement, of board thickness from 0.1mm to 10.00 mm, copper foil of 18, 35, 180, 360 mkm, maximum size up to 1600 mm. We are capable to supply high density interconnect (HDI) boards with blind and buried holes, and X-ray testing of inner layers. 

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Our boards boast outstanding quality and are 100% electro-tested before shipment. We provide different kinds of pad treatment such as HASL, immersion gold, flash gold, carbon, gold-finger, OSP, ENEPIG.    
 

'Sheng Lee Technology Inc.' has successfully completed a transition to a non-lead  technology. Our printed circuit boards contain no lead. We are in strict compliance with the environment protection requirements.